Metal Substrate PCB in Devices

Metal PCB substrate is composed of metal substrate (such as aluminum, copper, iron, and silicon steel plate), high thermal conductivity insulating medium layer, and copper foil. An insulating medium layer is generally used in high thermal conductivity epoxy glass fiber cloth bonding sheets or high thermal conductivity of the epoxy resin, the thickness of the insulating medium layer of 80 μm-100 μm, the thickness of the metal plate specifications for the 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 3.0 mm. A variety of metal substrate characteristics and application areas: iron-based copper-clad and silicon steel copper-clad sheet has excellent electrical properties, magnetic conductivity, Pressure resistance, and high strength of the substrate. Mainly used for brushless DC motors, tape recorders, recorders with spindle motors, and intelligent drives. However, the magnetic properties of silicon steel copper-clad plate are better than the iron-based copper-clad plate; copper-based copper-clad plate has the basic performance of aluminum-based copper-clad plate, its heat dissipation is better than the aluminum-based copper-clad plate, this kind of substrate can carry high currents, used in the manufacture of power electronics and automotive electronics and other high-power circuits with the PCB, but the copper substrate density, high value, easy to oxidize, so that the application of its application has been limited, and the amount of far less than the aluminum-based copper-clad plate. metal substrate PCBs

The benefits of metal-based PCB
(1) High thermal conductivity: Standard PCBs with FR4 and CEM3 have weak interlayer insulation and low thermal conductivity. Without proper heat dissipation, internal temperatures may rise and affect internal components. Metal PCBs made from aluminum have excellent thermal conductivity and help keep internal components safe.

(2) Good Dimensional Stability: Metal core PCBs exhibit good dimensional stability compared to FR4 or CEM3 PCBs. When the aluminum PCB is heated to temperatures ranging from 30 degrees Celsius to 140? 150 degrees Celsius, its dimensions expand between 2.5-3%.

(3) High Thermal Expansion: Coefficient of Thermal Expansion (CTE) is a term used to describe the expansion or contraction of a substance at temperature. Aluminum and copper have a higher CTE than ordinary FR4, with a thermal conductivity of W / cK.

Aluminum-based copper-clad laminates have excellent electrical properties, heat dissipation, electromagnetic shielding, high voltage, and bending plus q-, ah energy, mainly used in automobiles, motorcycles, computers, home appliances, communication electronics, and other electronic products. It is mainly used in automobiles, motorcycles, computers, home appliances, communication electronics, and power electronics. Metal PCB substrate with aluminum-based copper-cladding board has the largest market volume. Automobile Electronic equipment: ignition, voltage I ah section, mock ether meter, automatic safety control system, light conversion system, AC converter, SW power supply; Motorcycle electronics: power regulator, ignition, regulator; computer: power supply unit, floppy disk drive, CPU; Power Supplies; Switching Regulators, Transfer Switches, DC-DC Converters, Voltage Regulators, Regulators, DC-AC Converters, Large Scale Power Supplies, Solar Power Substrates. Board; communication electronics: car phone, cell phone high-frequency increase, filtering circuit, sending circuit;

With the development of electronic technology, the market demand for aluminum-based copper-clad laminates is heating up, and at the same time, the technical requirements for metal PCB substrates are getting higher and higher. The higher thermal conductivity required for metal PCB substrates, and aluminum-based copper-clad laminates requires to withstand higher breakdown voltages, with a maximum breakdown voltage of up to 15 kV (DC, AC), 704 factory research institute has been able to provide 8 kV (AC) and 10 kV (DC) aluminum-based copper-clad plate; aluminum substrate to the development of multilayer, need for high thermal conductivity aluminum-based CCL. Aluminum substrate to multilayer development, the need for high thermal conductivity of aluminum-based CCL sheet and its supporting thermal conductive film.

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