Eight tips on electronic component packaging!
The packaging form of SMD components is a packaging form of semiconductor devices.SMT involves a wide range of parts with different styles, many of which have formed a common standard in the industry, mainly including some chip capacitors and resistors.Many of them are still undergoing constant changes, especially IC parts, whose packaging forms are changing endlessly.Traditional pin packaging is experiencing the impact of a new generation of packaging forms.(BGA, FLIP CHIP, etc.)
SOP is the abbreviation of SmallOutlinePackage, namely small outline package. The SOP packaging technology was successfully developed by Philips from 1968 to 1969. Later, SOJ (J-pin small outline package), TSOP (thin small outline package), VSOP (very small outline package), SSOP (reduced SOP), TSSOP (thin reduced SOP), SOT (small outline transistor), SOIC (small outline integrated circuit), etc. were gradually derived.
DIP is the abbreviation of DoubleIn linePackage, that is, dual in-line package. One of the plug-in packages, the pins are led out from both sides of the package, and the packaging materials are plastic and ceramic. DIP is a popular plug-in package. Its application range includes standard logic IC, memory LSI, microcomputer circuit, etc.
PLCC is the abbreviation of Plastic LeadedChip Carrier, namely plastic packaging J lead chip package. The PLCC package is square in shape, 32 pin package, with pins all around. The overall dimension is much smaller than that of DIP package. PLCC package is suitable for installing and wiring on PCB with SMT surface mounting technology, and has the advantages of small size and high reliability.
TQFP is the abbreviation of thin quad flat package, namely thin plastic package. The four sided flat pack (TQFP) process can effectively use space, thus reducing the requirements for the space size of printed circuit boards. Due to the reduced height and volume, this packaging process is very suitable for applications requiring high space, such as PCMCIA cards and network devices. Almost all of ALTERA’s CPLD/FPGA have TQFP packages.
PQFP is the abbreviation of Plastic QuadFlatPackage in English, that is, plastic package quad flat package. The distance between the chip pins of PQFP package is very small, and the pins are very thin. Generally, large-scale or very large-scale integrated circuits adopt this package form, and the number of pins is generally more than 100.
TSOP is the abbreviation of ThinSmallOutlinePackage, namely thin small size package. A typical feature of TSOP memory packaging technology is to make pins around the package chip. TSOP is suitable for installing and wiring on PCB (printed circuit board) using SMT technology (surface mounting technology). When TSOP package dimensions are used, parasitic parameters (output voltage disturbance caused by large current changes) are reduced. It is suitable for high-frequency applications, with convenient operation and high reliability.
BGA is the abbreviation of BallGridArrayPackage, namely ball grid array package.In the 1990s, with the progress of technology, the chip integration has been continuously improved, the number of I/O pins has increased dramatically, the power consumption has also increased, and the requirements for integrated circuit packaging have become stricter. In order to meet the needs of development, BGA packaging has been applied to production.
There are 9 common packages of SMD resistors, which are represented by two size codes.One size code is the EIA code represented by four digits. The first two digits and the last two digits respectively represent the length and width of the resistance in inches. The 0603 package is often referred to as the imperial code.The other is metric code, which is also represented by 4 digits, and its unit is mm.