As the electronics industry keeps pushing for higher micropore density and better signal integrity on printed circuit boards,micropore reliability has become a critical focus—especially when it comes to high-performance products. In fact, micropore reliability in high-end PCBs directly impacts the overall quality and service life of electronic products, making it a core concern for IPC and industry practitioners alike. For a deeper dive into high-density interconnect (HDI) design and IPC standards, check out our guide: HDI Circuit Board Design: IPC Standards & Practical Tips from an Engineer
Real-world failures are showing up across OEMs, even on boards that passed standard inspection protocols.
Several IPC OEM member companies have shared field examples of micropore failures in high-end hardware.
These issues often stay undetected through bare PCBA manufacturing, inspection, and initial acceptance.
Problems typically appear later in the product lifecycle:
- During in-circuit testing after reflow soldering
- In Environmental Stress Screening (ESS) at box-level assembly
- Once the product is in service with end customers
What makes this trend especially concerning is that many failing units fully passed traditional lot acceptance tests under IPC-6010, the widely used PCB qualification and performance specification.
Data collected by IPC shows that relying only on thermal stress microsectioning and optical microscopy is no longer sufficient to ensure micropore reliability—this traditional approach often misses subtle defects that can compromise the stability of micro via connections, especially when it comes to detecting weak interfaces between micro vias and target pads.
Industry Response and IPC-WP-023 White Paper
In 2018, IPC addressed this gap by releasing IPC-WP-023, a technical solutions white paper focused on performance-based OEM acceptance for PCBs.
Titled Passing chain continuity reflow test: hidden reliability threat – weak microporous interface, the document highlights serious reliability concerns.
It specifically calls out risks with stacked micro vias, caused by weak interfaces between micro via target pads and electrolytic copper fill.
The paper supports stacked micro via failures observed across numerous IPC member companies with real testing data.
IPC Technical Committee for Micro Via Issues
Following the release of IPC-WP-023, the IPC V-TSL-MVIA Weak Interface Micro via Fault Technical Solutions Subcommittee formed in late 2018.
Its role is to investigate root causes of these failures and develop shared industry resources.
The group delivered its first public update at IPC APEX EXPO 2019 and continues to share findings as its research progresses.
Official IPC Warning and Upcoming Standards
IPC has published a formal warning that will be included in the upcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.
The statement reads:
“In the past few years, there have been many examples of post fabrication microporous failures. Usually, these failures occur during reflow, but they are usually undetectable (potential) at room temperature. During assembly, the more obvious the failures are, the more expensive they become. If products are not found until they are put into use, they will pose a greater cost risk, and more importantly, may pose a safety risk.”
This IPC micro via warning reflects real field experience, not just theoretical lab testing.
Shifting to Performance-Based Acceptance Testing
Looking ahead, IPC is moving away from traditional microsection evaluation toward performance-based acceptance testing, with a key focus on micropore reliability and overall product stability.
This approach was first proposed several years ago by the IPC D-33a Rigid Printed Board Performance Task Group.
IPC is collaborating with multiple committees to revise existing thermal stress and thermal shock test methods:
- IPC-TM-650 Method 2.6.27 (thermal stress)
- IPC-TM-650 Method [2.6.7.2](2.6.7.2) (thermal shock)
The updated methods will use test coupons with resistance monitoring, such as those defined in IPC-2221B Appendix D.
About IPC
IPC is a global electronics industry association headquartered in Bannockburn, Illinois.
It serves around 5,000 member locations across design, PCB manufacturing, electronics assembly, and testing.
As a member-led organization, IPC develops industry standards, training programs, market research, and public policy to support the $2 trillion global electronics sector.
It operates additional offices across North America, Europe, Russia, India, Thailand, and multiple cities in China including Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou, and Beijing.
