High-Density Wiring & Superior Electrical Performance for PCB
Overview of HDI PCB
Compared with ordinary multi-layer PCBs, the core advantages of HDI circuit boards lie in “precision” and “efficiency”.
>It is a high-end printed circuit board made through advanced precision processes such as high-density wiring, small hole diameters, and blind vias.
Structural Composition
HDI PCB The HDI circuit board is classified by the number of blind-buried holes into low-order (1-2 orders), medium-order (2-3 orders), and high-order (3-4 orders and above)
Key Design Considerations
HDI PCB Circuit layout design: The core principle is “fine wiring + interference isolation”. The line width and spacing of the outer layers need to match the pin density of the components (conventional ≤ 3 mil, for higher grades it can reach 1-2 mil), to avoid line intersections and excessive length; the inner layers strictly distinguish the power layer, ground layer and signal lines, adopt “power-ground” paired layout, reduce signal crosstalk, and high-frequency signal lines need impedance matching design (such as 50Ω, 100Ω), to reduce signal attenuation.
Multi-Field Applications
HDI-PCBs In terms of application, as the “core neural network” of high-end electronic devices, HDI circuit boards are widely used in consumer electronics, communication, automotive electronics, medical fields, artificial intelligence, and aerospace and military industries. They directly determine the operational accuracy and stability of terminal devices and are the core basic components of high-end electronic manufacturing.
Material Selection & Cost Reference
HDI-PCB circuit board is mainly composed of high-performance FR-4 glass fiber epoxy resin. In high-end scenarios, it can be combined with Rogers, PTFE, etc. for high-frequency and high-speed materials, as well as materials with high Tg and no halogen. It is also equipped with 2-5μm ultra-thin copper foil to ensure heat resistance, insulation, and signal transmission performance.
