Metal-based copper-clad laminates were born and developed in response to the rapid advancement of production and manufacturing technology in the electronics industry. As early as the early fifties, Japanese thick film research experts put forward the idea of this process design. It was not until 1969 that the manufacturing technology was practically applied. Metal core pcb
The copper substrate is one of the more expensive metal substrates, and aluminum substrate compared to the material is relatively special, heat dissipation is also relatively good, so the price will be relatively more expensive, mainly for high-frequency circuits as well as high and low-temperature changes in the region and precision communications equipment heat dissipation and architectural decoration industry
(1)Thermal Expansion
Thermal expansion and contraction is the common nature of matter, the coefficient of thermal expansion of different substances is different. Metal substrate can effectively solve the problem of heat dissipation, so that the thermal expansion and contraction of different substances of the components on the circuit board can be alleviated, and the durability and reliability of the whole machine and electronic equipment can be improved.
(2) Heat Dissipation
At present, many double-sided boards and multilayer boards have high density and high power, and it is difficult to emit heat. Conventional circuit board substrates such as FR4, and CEM3 are poor conductors of heat, interlayer insulation, heat is not emitted, resulting in high-temperature failure of electronic components, and metal-based printed circuit boards can solve this heat dissipation problem.
(3) Dimensional stability
Metal substrate size is much more stable than the insulating material board. Aluminum-based printed circuit boards, and aluminum sandwich panels, from 30 ℃ heated to 140 ~ 150 ℃, the size change of 2.5 ~ 3.0%.
(4) Wide range of applications
Iron substrate, with shielding, can replace brittle ceramic substrate, replace components such as heat sinks, improve product heat resistance and physical properties, and reduce production costs and labor.
In summary, the aluminum substrate is a unique metal-based copper-clad plate with good thermal conductivity, electrical insulation properties, and mechanical processing performance. Aluminum substrate is currently the most used metal substrate, aluminum substrate has 10 times higher thermal conductivity than epoxy resin substrate. Aluminum substrates are divided into flexible aluminum substrates, mixed aluminum substrates, multilayer aluminum substrates, through-hole aluminum substrates, etc. Copper substrate is the most expensive type of metal substrate, thermal conductivity than aluminum substrate and iron substrate is many times better than the circuit layer requires a large current-carrying capacity, which should use a thicker copper foil, the thickness of the general 35 μm ~ 280 μm; copper substrate is divided into immersed copper substrate, silver-plated copper substrate, tin spraying copper substrate, oxidation-resistant copper substrate and so on. Metal core pcb