How Much Do You Know about PCB Burn-in Board Testing?

The burn-in board is a loaded board used for the high-temperature aging test. PCB aging board means that some component parameters on the circuit board will change after the circuit board is powered on for a certain period under certain conditions. This change is related to the use time of the circuit board, which is not allowed for some circuit boards with special purposes. Therefore, many circuit boards will undergo anti-aging treatment before leaving the factory, making the circuit stable before use, which can greatly improve reliability and safety.


The burn-in board is a special type of board that is mainly used for aging testing. Components such as ASICs are installed on these boards for testing. A dedicated socket is provided on the burn-in board for fixing the IC therein. During the manufacturing process of printed circuit boards (PCBs), different types of testing and inspection processes are performed. During the aging test, the IC placed on the board is subjected to tremendous pressure. This helps identify defects and faults. These plates can withstand high temperatures during testing. During this process, the temperature remains as high as 257 ° F (125 ° C). Similarly, during this process, these plates are placed in an aging furnace. Provide the necessary voltage for the sample to be tested. After completing this pressure test, samples will be screened. This helps ensure that they have passed the oven test. This helps ensure the quality and functionality of the manufactured PCB and checks for defects. Therefore, if any defects fundamentally exist, they can be eliminated at an early stage of manufacturing.


The method of PCB aging in the burn-in board testing is generally in a general industrial refrigerator, where a single piece of solderless components are fixed fixedly, and the temperature generally varies alternately between – 40 ℃ and+55 ℃. During this process, the lower temperature should be maintained for 1 hour, and then slowly restored to room temperature. It should be maintained for 4 hours at room temperature, and then slowly warmed up to a high set temperature after 4 hours. This state should also be maintained for 2 hours, then slowly reduce to room temperature, which also requires holding for 2 hours. Take out the small circuit and check the health of the vias. This process requires two cycles to ensure better performance.


During the testing process, the burn-in board will be exposed to high temperatures. Therefore,the advanced materials are used on these boards. A special version of a flame retardant or FR4 material (high Tg FR4) used to enable the board to withstand a temperature of 125 ℃. If higher temperatures are to be applied, use other materials. For temperatures up to 250 ℃, use polyimide materials. If the temperature is very high in the range of 300 ℃, the most suitable material is high-quality polyimide.

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