Rogers RO4350B PCB: Specifications, Cost and Fabrication

For RF and microwave design teams, Rogers RO4350B has become one of the most widely used high-frequency substrates on the market.

Boards built with this material are known as Rogers RO4350B PCB, and they solve a real industry pain point: reliable high-frequency performance without the high cost of PTFE-based materials.

Rogers RO4350B PCB provides the low loss and stable dielectric properties RF engineers need for consistent impedance-controlled designs, including filters, couplers and signal distribution networks.

Specifying RO4350B is mostly a paperwork exercise on the buying side. Three numbers matter when you compare quotes: Dk 3.48 +/-0.05, Df 0.0037 at 10 GHz, and a Z-axis CTE of 32 ppm/°C. Thickness availability, panel size, copper foil type and lead time differ between distributors, so ask for the current datasheet revision and a stack-up drawing with your quote, not after the order.

This combination makes it particularly well suited for broadband RF and microwave systems.

Drilling Performance and Tool Life

Hole wall roughness typically stays between 8 and 25 microns, even after thousands of hits.

RO4350B drills cleanly with standard epoxy/glass-compatible bits. Hole-wall roughness stays between 8 and 25 microns even after extended tool use, and tools commonly pass 2,000 hits while holding acceptable quality. Drilling parameters, tool-life data and lamination notes are collected in our RO4350 fabrication guide.

Processing and Cost Advantages

Rogers RO4350B laminates offer tight Dk control and low loss while using nearly the same fabrication flow as standard FR4.

They cost significantly less than conventional microwave laminates and do not require special through-hole treatments or handling associated with PTFE materials.

The material carries a UL 94 V-0 flammability rating, making it suitable for active devices and high-power RF circuits where safety and reliability are required.

Key Specifications

  • Dielectric Constant (Dk): 3.48 ± 0.05
  • Dissipation Factor (Df): 0.0037 at 10 GHz
  • Z‑axis Thermal Expansion: 32 ppm/°C

Real-World Benefits

  • Compatible with standard FR4 processes for lower fabrication cost
  • Lower cost than traditional high-frequency laminates
  • Excellent dimensional stability across temperature and frequency

OPCBA operates production lines optimized for Rogers RO4350B PCB manufacturing.

If you’re working on an RF, microwave or broadband design, we can support your prototype and volume production needs.

Contact us today to discuss your project.

Shopping Cart
Scroll to Top