Flexible PCB (also known as FPCB) is a high-reliability, lightweight circuit board built on flexible dielectric substrates. It is mainly composed of an insulating base layer, a conductive copper layer, and adhesive layers in between when needed.
Thanks to continuous automated production, high wiring density, compact size and excellent bendability, FPC PCB has become widely used in military electronics, consumer devices, and industrial products—including digital cameras, smart watches, laptops and more. For a clear overview of how flexible PCBs fit into the broader PCB family, explore our guide: PCB Plate Classification: Types by Layers & Substrate
At opcba.com, we maintain a complete set of mature processing capabilities for flexible circuits, supporting both standard FPC and high-complexity rigid-flex designs for mass production and prototyping.
Key Materials for FPC PCB Manufacturing
From our production experience, material selection directly affects flexibility, thermal stability and final product reliability. We work with industry-leading brands to ensure consistent performance.
- Main base materials: Taiflex, Graceth, SY
- PCB laminate materials: SY, ITEQ, KB
- Insulating film: PI, PET
- Coverlay films: Taiflex, Graceth, SY
Core Technical Specifications
Our FPC PCB processing covers a full range of precision parameters to meet both prototype and mass-production requirements.
- Layer count: 1–14 layers for samples, 1–12 layers for mass production
- Finished board thickness: 0.25–6.0 mm (rigid-flex included)
- Minimum line width / spacing: 0.05 mm / 0.05 mm
- Maximum panel size: 230 × 450 mm
- Copper thickness options: 12 µm, 18 µm, 36 µm, 70 µm
- Stiffener materials: FR4, PI, PET, SUS, PSA
- Surface finish: ENIG, immersion tin, OSP, immersion silver, electroplated gold
Drilling & Hole Processing Precision
Hole quality and accuracy are especially critical for flexible circuits, as they directly impact assembly yield and long-term stability.
- Minimum mechanical hole: 0.15 mm; minimum laser hole: 0.1 mm
- Hole tolerance: NPTH ±0.05 mm, PTH ±0.075 mm
- Minimum pad size: 5 mil (inner layer), 4 mil (outer layer)
Rigid-Flex PCB Special Capabilities
rigid-flex PCB combines the stability of rigid boards with the flexibility of FPC, ideal for compact, multi-shape products. Our specialized capabilities include:
- Minimum board thickness: 0.1 mm (FPC), up to 1.0 mm for 10-layer designs
- Peel strength: ≥1.4 N
- Planeness: ≤15 µm before baking, ≤30 µm after baking
- Thermal shock resistance: 288℃ for 3 times within 10 seconds
- Gold wire bonding pull strength: >6 g
Film & Stiffener Processing Details
We support high-precision coverlay and stiffener processing to meet tight assembly requirements.
- Coverlay colors: yellow, black
- Coverlay minimum opening: 0.6×0.6 mm (standard) to 0.5×0.5 mm (precision)
- Stiffener size range: 4×5 mm up to 32×32 mm
- Alignment accuracy: ±0.075 mm
If you have questions about rigid-flex PCB design, processing limits or custom requirements, feel free to contact opcba.com for a detailed inquiry and technical support.
