Overview of AD9988-FMCB-EBZ
tv-mainboard-assembly is a functional unit completed after the welding, assembly and testing of components on the basis of a PCB. It directly determines the performance and reliability of electronic devices and is widely used in the entire process of various electronic equipment.
AD9988-FMCB-EBZ Key control points for production process
1. Control of solder paste: Store at low temperature, reheat and stir, control printing accuracy, and prevent missed printing and continuous soldering.
2. Soldering control: Verify the position of the components, ensure the soldering accuracy, and prevent any errors or omissions.
3. Return soldering control: Precisely control the heating curve to prevent false soldering and damage to components.
4. Anti-static / Cleaning / Inspection Control: Full-process anti-static measures are implemented. Cleaning is free of residue. Each process undergoes strict self-inspection and mutual inspection.
Core Components of AD9988-FMCB-EBZ
1. Basic Carrier: PCB (single layer/double layer/multi-layer/HDI), providing installation and interconnection support for components.
2. Core Components: Passive components (resistors, capacitors, etc.), active components (chips, ICs, etc.), connection components (connectors, etc.), auxiliary components (fuses, etc.).
3. Auxiliary Materials: Soldering materials (solder paste, flux), fixation materials (thermal conductive glue, insulating glue)
Core Production Process of AD9988-FMCB-EBZ (8-stage Simplification)
1. PCB Incoming Inspection (IQC): Screening for quality issues such as PCB circuits, hole diameters, and surface conditions.
2. Incoming Inspection and Material Preparation of Components: Verifying model parameters, categorizing and preparing materials to avoid wrong or damaged materials.
3. Solder Paste Printing: Uniformly applying solder paste on PCB pads, controlling thickness and accuracy.
4. SMT Assembly: Precisely placing components onto pads, controlling assembly accuracy.
5. Reflow Soldering: Melting solder paste at high temperature to achieve secure connection between components and PCB.
6. DIP Insertion Welding (as needed): Hand/automated insertion welding of components to ensure firm connection without short circuits.
7. Cleaning and Repair: Removing residual impurities and repairing short circuits, loose soldering, etc.
8. Finished Product Inspection (FQC) and Packaging: Inspecting appearance and functionality, packaging for anti-static and moisture-proof delivery.
