The thermal conductivity of aluminum substrates, pcb aluminium substrate, is one of the important indicators for evaluating their quality. Two other significant factors are the thermal resistance and pressure resistance of the aluminum substrate. Currently, the common thermal conductivity values for aluminum substrates in the market are generally around 1.0 W/mK and 2.0 W/mK. However, one cannot solely rely on the thermal conductivity to assess the quality of aluminum substrates. Instead, the performance of aluminum substrates is determined by a combination of thermal conductivity, thermal resistance, and pressure resistance; it is not dictated by a single factor. pcb aluminium substrate
The specific thermal conductivity of aluminum substrates can be measured using instruments. The level of thermal conductivity directly affects the price of aluminum substrates; typically, the higher the thermal conductivity, the higher the price will be. A higher thermal conductivity is often a symbol of better functionality. Aluminum substrates, a common type of metal base copper clad laminate, possess excellent thermal conductivity, electrical insulation properties, and mechanical processing capabilities. The thermal conductivity values for aluminum substrates usually range from 1.0 to 2.0, and the specific value will depend on the requirements of the product.
When there are high copper thickness requirements, the production challenges include:
1.Uniformity of Printed Solder: It is very challenging to print solder due to the extreme thickness of the etched circuit lines.
2.Compensation for Engineering Design Width: This involves compensation for the line width tolerance after etching, given the fixed copper thickness.
3.Oxidation Treatment of the Aluminum Plate: This includes a series of processes: strong degreasing and cleaning, neutralization with dilute nitric acid, roughening, oxidation, acid-base neutralization, pore sealing, and baking.
The performance of aluminum substrates is reflected in several aspects:
1.Heat dissipation
2.Thermal expansion
3.Dimensional stability
Many FR4 double-sided boards and multi-layer boards have high density and power; they struggle to dissipate heat, leading to localized overheating of electronic devices, which can cause the failure of electronic components due to high temperatures. Aluminum printed circuit boards can effectively address thermal dissipation issues, thus alleviating the thermal expansion and contraction problems of different materials on the board. This leads to improved durability and reliability of the overall machine and electronic devices, replacing components such as heat sinks and enhancing the thermal and physical properties of the product, while also reducing production costs and labor. pcb aluminium substrate